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SU - COPPER WIRE BONDING CAPILLARY...

he history of copper wire bonding packaging interconnect can be traced back to the eighties, spurred then as an alternative to the costly gold. And for decades, SPT has been a leading supplier for numerous customers bonding with large copper wire diameters. Today, copper wire bonding has regained momentum as the semiconductor packaging industry looks for cost reduction alternatives due to rise in gold price, and is commanding more foothold, not only in low pin count discrete packages but fine pitch IC. Also, copper wire bonding offers other significant advantages over gold superior performance in terms of electrical and thermal conductivity better product reliability due to less intermetallic growth causing voids and higher break load during wire pull testing. However, it also comes with various bonding and process challenges such as oxidation of copper wire at low temperature, short tail', and fish tail' which is commonly associated with copper wire bonding interconnect assembly. A pioneer and a leader in wire bonding tool innovations, SPT has been in the forefront, involved in collaborations with many customers in their development of a new capillary for copper wire bonding application. SPT has taken its highly successful series, SI (Stitch Integrator) developed for enhanced stitch bondability to the next level, introducing SU the capillary solution specifically tailored for copper wire bonding. The SU capillary the new Standard for Copper - incorporates an excellent durable material with SPT's proprietary enhanced surface finishing with superior gripping' features to deliver high reliability stitch bonds for a wide range of copper wire bonding applications from fine wire 20 m to large wire of 100 m wire sizes....

Copper Wire Wire Clamp...

Capillary Tail Bond...

Short Tail...

Fish' Tail...

Bonded with SU' Capillary...

Copper remains after Stitch pull...

SOLUTION FOR A ROBUST COPPER WIRE BONDING PROCESS...

BONDABILITY...

In copper wire bonding process, bond integrity at the interface between the stitch and leaded or laminate surface is measured by using a wire pull tester. The bonded wire is pulled as close as possible to the stitch, and the pull test strength reading (in gram-force) is taken. Expectedly, the higher pull test strength value is desired, and a remaining stitch failure mode is indicative of a good bond at the interface. Table A- shows the stitch bond superiority of the SU capillary as the stitch pul...

Document Keywords

SU Capillary - Brochure - English PDF 770 KB file products bonding capillaries brochures su capillary brochure english

About Small Precision Tools, Inc.

Bonding Capillaries and Wedge Bonding Tools for thermosonic wire bonding. Die Bonding Tools. Fine Ceramic Solutions CIM for Medical, Industiral and electronic applications. Fine Machining Parts

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