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Document Brief

Challenging Substrates...

Enhanced Stitch Bondability...

The pressure to reduce the cost of products has indirectly instilled certain elements of inconsistency to the lead frame and substrate materials, which directly affect the bond reliability of the stitch bonds. Inconsistent lead frame and substrate quality often results in NSOL, short tail or low stitch pull readings during wire bond. Most of the time, the problem is only known after die attach and during wire bond. The challenge is to be able to improve the stitch bondability for these types of lead frames/substrates. The Stitch Integrator capillary helps to improve the bonding performance as shown in the following application....

Bonding Condition ...

Capillary Bond Pad Pitch Bonder Wire Type Device SI - 30080-385F-ZB34TP 60um KNS 8028 1mil Au wire Lead frame base...

Fine-Pitch Copper Wire...

Bonding responses monitoring for SI capillary ...

SPT Roth Ltd...

Werkstrasse 28, CH-3250 Lyss, Switzerland Tel Fax ...

Wire pull readings and CpK Bonder Stoppages Statistics Open / Short Test Statistics...

Small Precision Tools Inc...

1330 Clegg Street, Petaluma, CA 94954, USA Tel Fax E-Mail 1 707 765 4545 1 707 778 2271 info@sptca.com...

2N9 Au Wire Bonding...

++ 41 32 387 80 80 ++ 41 32 387 80 88 info@sptroth.com...

SPT Asia Pte Ltd...

Key Notes Destructive test for both ball shear and wire pull has shown that the bondability for the ball and stitch bonds was within the manufacturing specification with good Cpk control. Visually, the ball and stitch bonds at 800K bonds did not show any symptoms of golf ball, irregular ball squashed out or damaged stitch bonds. Bonder stoppages throughout the tool life of the SI capillary was recorded at, NSOL 614ppm, short tail 512ppm. No EFO open was encountered. During the O/S test, device failure bonded using the SI capillary showed a substantial reduction in ppm as compared to non-SI capillary on the same device type. Overall, the SI capillary showed an improvement of more than 70% with reduced second bond failure. This indicates that the stitch bondability has improved using the SI capillary. 970 Toa Payoh North, #07-25/26, Singapore 318992 Tel Fax E-Mail 65 6253 5577 65 6250 2725 info@sptasia.com...

Small Precision Tool (Phil.) Corp....

35 Libertad Street Mandaluyong City 1550 Philippines Tel Fax E-Mail 632 533-7067 632 531-5780 info@sptphil.com...

Small Precision Tool Co. Ltd....

A2 Building, Liyuan Economic Development Zone, Wuxi, Jiangsu, P.R.Chin...

Document Keywords

SI Capillary Brochure - Revised - 300108 - English PDF 740 KB file products bonding capillaries brochures si capillary brochure revised 300108 english

About Small Precision Tools, Inc.

Bonding Capillaries and Wedge Bonding Tools for thermosonic wire bonding. Die Bonding Tools. Fine Ceramic Solutions CIM for Medical, Industiral and electronic applications. Fine Machining Parts

Contact

707-762-5880, 800-346-4927 (toll free)
Fax: 707-778-2271

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