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APPLICATION NOTE...

Diode Chips, Beam-Lead Diodes, Capacitors Bonding Methods and Packaging...

Diode Chips...

Handling Skyworks chips are shipped in plastic chip trays containing up to 400 individual devices. The chips may be removed from the tray and positioned for inspection or bonding using tweezers or a vacuum pickup. Particular care must be exercised to avoid any mechanical damage to the active junction area when handling chips. In addition, if tweezers are used, care must be taken to avoid excessive force which might result in nicks or cracks. Special handling precautions are also required to avoid electrical damage by static discharge. For package opening instructions see Figure 4. Die Attach The recommended method for attaching Skyworks semiconductor chips to substrates is by means of a solder preform or silver epoxy. Basically this method involves the use of the preform or epoxy to form a joint between the gold metalized base of the chip and the metalized area of the substrate. Recommended preform materials are Gold (80%) Tin (20%) Gold (89.5% Gallium (0.5%) Germanium (10%) or Gold (90%) Germanium (10%). These are available from Alpha Metals, Jersey City, New Jersey. Recommended silver epoxy is Epo-Tek H31D Single Component from Epoxy Technology, Inc. Procedure The substrate may be heated directly by placement on a heater strip or hot plate. Resistance heating may also be used, in which case the localized heat is supplied by passing current through the appropriate metalized portion of the substrate by use of two contact electrodes. Hot gas heating may also be used, in which case the localized heat is supplied by a jet flow of heated forming gas or nitrogen....

Strip Heater or Hot Plate Metalized Gold Dot Metalized Gold Back Contact Vacuum Pick up Solder Preform Ceramic Substrate Chip Inert Atmosphere...

Figure 1. Die Attach Procedure...

Temperatures of approximately 280 C for gold-tin, 350 C for gold-gallium-germanium and 380 C for gold-germanium are recommended. A 100 C bake for 1 hour is recommended for silver epoxy. Exact temperatures should be determined empirically for the particular conditions at hand. The bonding should be done in an atmosphere of nitrogen or forming gas. Both solder preform and chip may best be handled by means of a vacuum pickup. A preform is placed on the desired location of the substrate followed by the chip. Appropriate force is maintained between substrate and chip while the preform melts and wets both substrate meta...

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